Mechanical Design

• Area
  Expertise
• Design Tools
  SolidWorks 3D
  Thousands of part CAD library
  Re-usable 3D blocks to accelerate mechanical design
• Case Processes
  Plastic case by mould
  Aluminum case by Die cut
  Aluminum case by CNC
  Sheet metal Bending or Punching
• In-House Engineering andManufacturing Symbiosis
  Design for Manufacturability (DfM) and Design for Test (DfT) optimization through close engineering and manufacturing collaboration Rapid Prototyping, Customization, Design Iterations
• 3D Printing
  Rapid-turn of alignment jigs, tooling, prototype mechanical parts, physical / build envelopes
• 3D Printing
  Rapid-turn of alignment jigs, tooling, prototype mechanical parts, physical / build envelopes

Hardware Optimization

We could offer the custom solutions based on our standard products, which don’t involve PCB redesign, we could add or remove some circuits on the standard boards.

Hardware Design Expertise

• Area
  Expertise
• Microprocessor Architectures
  ARM Cortex-A7, A8, A9, A15, A53, A72;
  ARM Cortex-M0, M0+, M3, M4, M7;
  8 and 16-bit microcontrollers
• Circuitries and Interfaces
  Power: Power management; Reverse voltage protection;
  ESD and transient protection; Power Isolation; Power over Ethernet; Design for Industrial Applications which require high product quality and system reliability.
  Memory and Storage: SSD, SATA, Nor-Flash, Nand-Flash, SPI-Flash, SDRAM, DDR4, SD/SDIO/MMC
  Multimedia: Audio, Video, Camera
  HMI: LCD, MIPI, CSI, LVDS, HDMI, DVI
  Connectivity: USB, Ethernet, CAN, Bluetooth, WiFi, PCle, SATA
  Serial: UART, SPI, I2C GPIO, A/D, D/A, and analog
  Sensors: magnetometers; Accelerometers;
  IR-thermopiles; humidity, light and other sensors
  Embedded Vision: CMOS sensors and other digital camera technology
• Schematic Capture
  Low EMI Design
  Advanced Power management
  Junction temperature sensing and thermal management
• PCB Layout
  Mixed speed and signal technology
  High-speed digital and analog design
  Low EMI/RFI design
  μBGA, dual-die, fine pitch, PoP (package-on-package), microvias PCB technology, passive components as small as 01005 inch (0402 metric) packaging
  Power rail separation, Power over Hours (PoH) analysis High-density, multi-layer (12+), small form factor PCBs Signal integrity analysis
  3D modeling
• Design Tools
  Cadence (OrCAD Capture and Allegro)
  Altium Designer/Protel
  SolidWorks 3D
  Re-usable schematic blocks, including layout stack-ups, to accelerate hardware design
• Circuitries and Interfaces
  Design for Manufacturability (DfM) and Design for Test (DfT) optimization through close engineering and manufacturing collaboration
  Component engineers select materials according to DfM principles, longevity, availability, reliability, cost, process and supply chain considerations
  Rapid Prototyping, Customization, Design Iterations
• Extensive Design Verification
  Voltage, Current, Power, Timing, Signal Integrity and EMI Measurement
  Functional Operation
  Temp Chamber Stability Testing
  PCBA Microsection Analysis including PCB stack-up, solder mask and cross sectional metallographic and microscopic examination
  Stress testing for revealing of product failure modes Radiated Emission, Conducted Emissions and Radiated Immunity Testing in compliance with FCC Part 15, EN55011, EN55022, CISPR11, CISPR22, and CISPR32
• Test
  Hardware design practices that incorporate testability features in PCBA design: JTAG, voltage, current, and signal test points

Software Development

EDATEC offers software engineering services to develop customized Board Support Packages for your specific application, including firmware, drivers, Linux BSP and advanced edge and cloud computing solutions.

Software Development Expertise

• Area
  Expertise
• Microprocessor Architectures
  ARM Cortex-A7, A8, A9, A15, A53, A72;
  ARM Cortex-M0, M0+, M3, M4, M7;
  8 and 16-bit microcontrollers
• OS
  RTOS (FreeRTOS, Azure OS, Zephyr OS, mbed OS,
  RT-thread OS) Linux
• Linux Distributions
  Raspberry Pi OS (Debian)
  Ubuntu OS
  Balena OS
  Yocto Project Linux Distribution
  Buildroot
• Software Components
  Bootloaders (u-boot, barebox)
  Device Drivers (Display, WiFi, Bluetooth, GPS, camera)
  Hardware Abstraction Layers
  Software ‘Glue’ modules (QT, Docker, OpenGL, OpenCV, OpenVX,TensorFlow, and more)
  Graphic Application (QT)
  Web UI (Dashboard, Diagnostic, RESTful API)
  Wireless (WiFi, BT, LoRaWAN, FSK)
  IoT (MQTT, OTA)
  Industrial Application (CODESYS Hardware Abstraction, Modbus)
  Test Application (Test framework, Stress test, Production test)
• Programming Language
  C/C++, Python, Java, Rust, node.js, Shell, HTML5
• Platform Optimization
  Power Management, system-wide analysis, boot time,
  POSIX & realtime, and insisted programming
• Complete Documentation
  Quick Start, Software Update, and technical guides
  Custom development guides based on actual customized hardware
• Flexible Delivery
  Deliver via GitHub, archives, binaries, or other methods of secure software delivery
• Production Ready
  Build your production images and have EDATEC flash them to your hardware

Compliance & Certifications

We also offer regulatory testing services, including EMC testing and Safety Testing. We support compliance with FCC (USA), ISED (Canada), CE (Europe:EMC Directive, Radio Equipment Directive), RCM (Australia/New Zealand).

We have experienced EMI professionals and engineers to help solve complex problems quickly and can provide rapid metal fabrication/modification options to ensure fast, efficient and low cost passage through testing.help solve complex problems quickly and can provide rapid metal fabrication/modification options to ensure fast, efficient and low cost passage through testing.

We have experienced EMI professionals and engineers to help solve complex problems quickly and can provide rapid metal fabrication/modification options to ensure fast, efficient and low cost passage through testing.help solve complex problems quickly and can provide rapid metal fabrication/modification options to ensure fast, efficient and low cost passage through testing. efficient and low cost passage through testing.help solve complex problems quickly and can provide rapid metal fabrication/modification options to ensure fast, efficient and low cost passage through testing.